Polkemic - producent profili i obrzeży meblowych
Guidelines for handling and application
Storage
It is recommended to store the Polkemic edge bandings in a room temperature of from 10 to 25°C in places, which are not exposed to weather conditions. In these conditions the storage time can be unlimited. No loss of quality was noticed when the Polkemic edge banding was stored in such environment.
Long-term storage of the edge bandings in a temperature below zero results in partial degradation of the product components and may cause discontinuities of the band surface.
Glues and glueing
The Polkemic edgebanding may be glued with all hot-melt glues available on the market, i.e. EVA, APAO, PA, PUR.
The temperature of the glue applied should strictly conform to the guidelines provided by the manufacturer in the Data Sheet. Remember that the temperature range depends on the type of the glue, the environment and the machine feed rate.
Prior to applying the glue to narrow planes one should store edge bandings in a positive temperature. It is not recommended to remove edge bandings from a cold room and place them immediately in a room where the temperature is above zero. If it is the case, however, it is recommended to keep edge bandings in a positive temperature for some time, e.g. overnight. The humidity of the boards, which the edge banding is to be stuck to, should be between 7 and 10%. The recommended temperature of the edge banding and the board should be 18°. Draughts should be avoided.
It is worth mentioning that in many cases the glue temperature in the melting pot is different from the glue temperature on the roller. In order to achieve the correct quality of the glueing process it is recommended to ensure a proper temperature on the roller.
Feed rate:
The feed rate of the edge banding machine may vary from 20 to 100 m/min.
Amount of glue
Depends on the type of the glue used. The manufacturer’s guidelines provided in the Data Sheet should be observed. Average values for a hot-melt EVA glue are from 150 to 210 g/m2. The glue layer should be applied uniformly across the whole width of the edge banding and the amount should be sufficient so that small drops of glue are squeezed out when the edge banding is pressed to the board. The glue should fill empty spaces between the chips in the board.
The amount of glue applied depends on:
- feed rate, the slower it is, the higher glue consumption is
- density of the board
- edge banding thickness; thicker banding requires more glue
- glue open time.
Average feed rate used for Polkemic PVC edge banding:
The recommended temperature range is closely related to the environment conditions and the feed rate.
Average machining parameters (depending on the glue type):
- glue temperature: 160-190° C;
- temperature of a straight edge banding machine, ready to work: 200-220° C;
- temperature of a shaped edge banding machine, ready to work: 190-200° C;
- feed rate of a straight edge banding machine: 20 – 100 m/min.
Replace the tools after each 100000 meters.
Most popular problems:
| Problem | Cause |
| After being applied the edge banding can easily be torn off the board; the glue remains on the board |
- too low temperature of the edge banding, the board or glue.
- low temperature of the room where glueing takes place or there is a draught in the shop |
| After being applied the edge banding can easily be torn off the board; glue remains on the edge banding | - too big difference of temperatures of the board, the edge banding and the glue. - too high temperature of the board |
| The „wave effect” visible on the side surface of the edge banding after milling | - too high feed rate - too small rotational speed of the cutter |
| A gap between the board and the edge banding |
- too small pressure of the roll - too low glue temperature - no initial stress in the edge banding - too low edge banding temperature - glue open time exceeded |
| Edge banding breaks | - inappropriate storage in a too low temperature |
| Edge banding subject to deformation | - high temperature in the storage area - exceeded temperature of the warming process prior to glueing |
